RFI Announcements - MTO Spark Tank

Quick Overview

DARPA is soliciting proposals for its Microelectronics Black Start program, aiming to develop domestic microelectronics manufacturing capabilities that can be rapidly scaled and adapted to different needs, even in the face of disruptions like TSMC falling into the ocean or other geopolitical events.

Key Points: DARPA is seeking proposals for the Microelectronics Black Start program to create a resilient, domestic microelectronics supply chain. The program aims to develop scalable and adaptable manufacturing capabilities for microelectronics. The solicitation was prompted by hypothetical scenarios such as TSMC falling into the ocean or the impact of geopolitical events like the Russian sanctions. Key objectives include identifying and leveraging existing US-based manufacturing capabilities, and developing new, non-traditional processing capabilities. DARPA is looking for proposals that can facilitate the manufacturing of a wide range of components and technologies, from simple to highly complex. The program seeks to create a flexible and adaptable "black start" capability that can be activated rapidly in response to disruptions. The solicitation is open to proposals that can address the entire lifecycle from design to manufacturing, including testing and scaling.

Context: The DARPA solicitation for Microelectronics Black Start addresses the critical need for robust and resilient domestic microelectronics manufacturing. In the context of global supply chain vulnerabilities, exemplified by events like the hypothetical loss of TSMC or disruptions caused by geopolitical issues, DARPA aims to foster a domestic ecosystem capable of rapidly producing advanced microelectronics. This program seeks to identify and leverage existing capabilities while also exploring innovative, non-traditional manufacturing approaches to ensure national security and technological independence.

Detailed Analysis

DARPA's "Microelectronics Black Start" program is a solicitation aimed at building a resilient and adaptable domestic microelectronics manufacturing capability. The program addresses the critical vulnerability of the current global supply chain, particularly the reliance on foreign foundries, and the potential impact of geopolitical events or disruptions. The solicitation seeks proposals that can outline how to rapidly establish or re-establish domestic manufacturing capabilities for a wide range of microelectronics. This includes leveraging existing facilities and exploring new, non-traditional manufacturing processes that can be scaled and adapted to different needs, such as those demonstrated by the response to the COVID-19 pandemic or potential geopolitical disruptions. The program aims to identify companies that can produce a variety of components, from basic to highly advanced, and to develop flexible manufacturing processes that can be quickly deployed. DARPA is soliciting proposals that address the entire manufacturing lifecycle, from design to testing and scaling, with a focus on achieving both high precision and cost-effectiveness. The program seeks innovative approaches to ensure that the U.S. can maintain a robust microelectronics manufacturing base, even in the face of unforeseen global challenges.