# RFI Announcements - MTO Spark Tank

Source: https://www.youtube.com/watch?v=snW1UrVgW5I
Recap page: https://rapidrecap.app/video/snW1UrVgW5I
Generated: 2025-09-19T19:33:44.848+00:00

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## Quick Overview

DARPA is soliciting proposals for its Microelectronics Black Start program, aiming to develop domestic microelectronics manufacturing capabilities that can be rapidly scaled and adapted to different needs, even in the face of disruptions like TSMC falling into the ocean or other geopolitical events.

**Key Points:**
- DARPA is seeking proposals for the Microelectronics Black Start program to create a resilient, domestic microelectronics supply chain.
- The program aims to develop scalable and adaptable manufacturing capabilities for microelectronics.
- The solicitation was prompted by hypothetical scenarios such as TSMC falling into the ocean or the impact of geopolitical events like the Russian sanctions.
- Key objectives include identifying and leveraging existing US-based manufacturing capabilities, and developing new, non-traditional processing capabilities.
- DARPA is looking for proposals that can facilitate the manufacturing of a wide range of components and technologies, from simple to highly complex.
- The program seeks to create a flexible and adaptable "black start" capability that can be activated rapidly in response to disruptions.
- The solicitation is open to proposals that can address the entire lifecycle from design to manufacturing, including testing and scaling.

![Screenshot at 17:08: The slide displays the DARPA logo and the title "Microelectronics Black Start," along with the question "What if TSMC fell into the ocean?" The background features an image of a large semiconductor manufacturing facility.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-17-08.png)

**Context:** The DARPA solicitation for Microelectronics Black Start addresses the critical need for robust and resilient domestic microelectronics manufacturing. In the context of global supply chain vulnerabilities, exemplified by events like the hypothetical loss of TSMC or disruptions caused by geopolitical issues, DARPA aims to foster a domestic ecosystem capable of rapidly producing advanced microelectronics. This program seeks to identify and leverage existing capabilities while also exploring innovative, non-traditional manufacturing approaches to ensure national security and technological independence.

## Detailed Analysis

DARPA's "Microelectronics Black Start" program is a solicitation aimed at building a resilient and adaptable domestic microelectronics manufacturing capability. The program addresses the critical vulnerability of the current global supply chain, particularly the reliance on foreign foundries, and the potential impact of geopolitical events or disruptions. The solicitation seeks proposals that can outline how to rapidly establish or re-establish domestic manufacturing capabilities for a wide range of microelectronics. This includes leveraging existing facilities and exploring new, non-traditional manufacturing processes that can be scaled and adapted to different needs, such as those demonstrated by the response to the COVID-19 pandemic or potential geopolitical disruptions. The program aims to identify companies that can produce a variety of components, from basic to highly advanced, and to develop flexible manufacturing processes that can be quickly deployed. DARPA is soliciting proposals that address the entire manufacturing lifecycle, from design to testing and scaling, with a focus on achieving both high precision and cost-effectiveness. The program seeks innovative approaches to ensure that the U.S. can maintain a robust microelectronics manufacturing base, even in the face of unforeseen global challenges.

### Program Goal

- Develop a resilient and adaptable domestic microelectronics manufacturing capability
- Address supply chain vulnerabilities and geopolitical risks

### Key Problem

- Reliance on foreign foundries and vulnerability to global disruptions
- Need for rapid scaling and adaptation of manufacturing

### Solicitation Focus

- Identifying and leveraging existing US capabilities
- Developing new, non-traditional processing methods
- Manufacturing diverse microelectronic components

### Key Objectives

- Ensure national security and technological independence
- Foster innovation in manufacturing processes
- Enable rapid response to supply chain disruptions

### Examples of Capabilities Sought

- Re-purposing existing facilities
- Adapting manufacturing processes
- Utilizing advanced automation and digital manufacturing

### Key Considerations

- Cost-effectiveness
- Scalability
- Flexibility
- Supply chain resilience

### Call for Proposals

- Seeking innovative ideas for "black start" manufacturing capabilities
- Input on manufacturing processes, design tools, and testing methodologies

![Screenshot at 17:08: The slide titled "Microelectronics Black Start" poses the question "What if TSMC fell into the ocean?", accompanied by an image of a large semiconductor fabrication plant, symbolizing the importance of domestic manufacturing.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-17-08.png)
![Screenshot at 17:17: A graphic depicting various quantum emitter symbols, representing different quantum technologies that could be integrated.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-17-17.png)
![Screenshot at 17:21: A visual representation of a quantum integrated photonic chip, illustrating the goal of unifying different quantum platforms.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-17-21.png)
![Screenshot at 17:48: A slide showing a scatter plot comparing relative performance against manufacturability \(Figure of Merit\) for various quantum sensors, categorizing them into different types.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-17-48.png)
![Screenshot at 18:00: A close-up image of a silicon wafer with multiple integrated circuits, representing new quantum sensor technology.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-18-00.png)
![Screenshot at 18:11: A diagram illustrating the concept of quantum integrated photonics, showing the integration of quantum emitters with photonic components.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-18-11.png)
![Screenshot at 18:39: A split image showing a "chip-scale atomic beam tube" on the left and a concept for "manufacturable quantum sensors" on the right, highlighting the transition from lab to scalable products.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-18-39.png)
![Screenshot at 19:39: A slide for "American-Made Microsystems" featuring a prominent image of the American flag, emphasizing the program's focus on domestic manufacturing.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-19-39.png)
![Screenshot at 21:51: A slide titled "Foundry Interfacing with Quantum Emitters" posing the question "Can we unify the platforms for quantum integrated photonics?" with relevant imagery.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-21-51.png)
![Screenshot at 23:53: A slide detailing "Molecular Machines" with a complex 3D rendering of a molecular structure, illustrating the program's focus on nanoscale engineering.](https://ss.rapidrecap.app/screens/snW1UrVgW5I/00-23-53.png)