Advanced Materials and Packaging - MTO Spark Tank

Quick Overview

The presentation explores advancements in microelectronics packaging, highlighting the need for integrated multi-physics design and manufacturing solutions, particularly for next-generation systems like the F-35 and Tomahawk missile. Key opportunities for improvement include co-design of electrical, thermal, and mechanical aspects, utilizing inverse design methodology, reducing 3D volume, and direct synthesis with multi-material additive manufacturing.

Key Points: The presentation focuses on microelectronics advanced packaging, emphasizing the integration of electrical, thermal, and mechanical considerations. Key opportunities for improvement include co-design methodologies, use of inverse design, reduction of 3D volume, and direct synthesis with multi-material additive manufacturing. Current EDA tools are noted as not adequately addressing structural, thermal, and electromagnetic considerations simultaneously for 3D designs. The video cites an EE Times article on the challenges of 3D IC designs, highlighting the need for solutions that work at the die and die-package level. Opportunities exist to leverage generative algorithms to assist in complex 3D multi-physics design spaces. The presentation touches upon the limitations of current 3D CAD and EDA tools, which often treat these physics domains separately. The goal is to move towards a more holistic design approach, integrating these diverse physical considerations from the outset.

Context: The presentation, delivered by Dr. David Meyer, Program Manager at DARPA/MTO, addresses the challenges and opportunities in advanced materials and packaging for microelectronics. It highlights the limitations of current design tools that treat different physics domains (electrical, thermal, structural, electromagnetic) separately. The focus is on developing more integrated design and manufacturing approaches, particularly for complex systems like military aircraft and missiles, by leveraging newer technologies and methodologies.